Job Description

Manufacturing Engineer Manager (Location: Phoenix, AZ area) Description: Client is looking for an experienced Manufacturing Engineering Manager who thrives in taking on new challenges, influencing and shaping a team and the product roadmap. As the Manager of Manufacturing Engineering, you will be managing an engaging team of 7-10 manufacturing engineers, implementing processes and procedures and collaborating to deliver leading edge electronics. The Manufacturing Engineering Manager will be involved with the Manufacturing Engineering operations to design, manufacture, test, and deliver rugged microelectronics that operate in the harshest environments, with extreme reliability and maintainability, for the Defense and Aerospace industries. *Note: Candidates need experience working with Printed Circuit Board Assembly as an Engineer, and a strong background in Electronics is required. Job Responsibility: • Direct the Manufacturing Engineering team’s day-to-day work, ensuring successful execution of Mfg efforts and responsibilities on products and programs • Identify, maintain, and grow technical expertise within the group and provide technical guidance to the manufacturing team. • Execute strategic initiatives and assigns responsibilities with the group to achieve business goals set by the business leadership and Annual Operating Plan. • Work with direct reports to identify strengths and development needs and grow their talents and skillsets through cross-trainings, mentorship, and on-going career development discussions. • Attract and retain talents that contribute to the growth and revenue of Client. • Hold self and team members accountable for their work output quality and for achieving on-time delivery of project milestones. • Align and motivate team around Client purpose, culture, and values, and drive clarity and understanding of project priorities, business goals and processes, roles and responsibilities. • Build open, trusting, and respectful relationships across the engineering teams. • Work closely with the Chief Engineer, Operations, Program Management, and Technical Project Managers to ensure OTD and quality on new product developments and production revenue. • Address issues and challenges directly by making rapid course corrections and driving necessary changes to achieve business objectives. • Establish professional and respectful collaborations with the rest of the functional groups and teams across Client. • Manage relationships with current vendors and subcontractors to ensure they remain on budget and provide quality on-time results, and work to identify other vendors and subcontractors as necessary to provide the best solutions for our products. Required Qualifications: *Note: Candidates need experience working with Printed Circuit Board Assembly as an Engineer, and a strong background in Electronics is required. • 5-7 years of overall experience with previous experience managing engineers. • Experience with process improvements and root cause analysis, such as 5 Whys, 8D, and Lean Six Sigma, etc. • Experience in microelectronics packaging processes is preferred. • Preferred experience with Wirebond, die bond, solder reflow, flip chip, SMT (Surface Mount technology) , wafer processing, etc. • Experience supporting proposal development for DoD contracts (DoD and/or Aerospace experience preferred). • Experience operating in a matrix style organization • BS or MS in relevant field • Ability to obtain a DoD Secret Clearance (an Active Clearance is NOT required to start this job).

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